Welcome and Agenda Review - Day 1 (with early prep)

A Roadmap to Intel's Core Business - Nicole Pedrami

Manufacturing Intel's Leading-Edge Products - Gregory Anderson

Photonic Circuit Research Opportunity with Practical Application to Future Generation Products - Mozhgan Mansuri

The Future of Moore's Law - Jack Hwang

Packaging and Test - Tom Rucker

Rotational Engineering Program - Kieshawn Lewis

Corporate Services - Operations, Experiences and Innovations - Mindy Koch

University Research Initiative - Gaby Cruz-Thompson

Corporate Quality Network Driving Intel’s Quality Excellence - Colleen Felsch

Working in the Gaming and Creator Segment - Mark Subotnick

Manufacturing Systems - Michael Fendrick

Introduction to Intel Connectivity Group - Saravan Rajendran

Delivering the Future of IC Packaging and Test - Steven Duggan

NAND Product and Solutions Group Technology and Opportunities - Roman Sancho